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The Harwin M80-7470422 is a Datamate J-Tek series board connector designed for power to the board applications. It features a male pin configuration with 4 positions and a 2 mm pitch. The component utilizes through-hole solder termination and operates within a temperature range of -55°C to +125°C. Constructed with phosphor bronze contacts gold-plated for reliability, it employs a polyamide (PA) insulator rated UL94 V-0. This straight-mount header supports a current rating of 3 A and provides secure electrical interconnection in compact electronic assemblies.
Verify the specific datasheet revision and RoHS compliance status directly with Harwin or authorized distributors before procurement. Confirm that the ordering suffix matches the required contact plating and housing material specifications. Ensure compatibility with mating receptacles from the same Datamate J-Tek family to guarantee proper alignment and locking mechanism engagement during assembly.
Select this component when a low-profile, four-position male header is required for direct board mounting. The 2 mm pitch allows for dense circuit layouts while maintaining adequate spacing for safety clearance. Consider the through-hole installation method for applications prioritizing mechanical strength over surface mount convenience. Validate that the 3 A current rating meets the thermal requirements of the target circuit design.
This part belongs to the Harwin Datamate J-Tek family, known for its modular connectivity solutions. The M80 series designation indicates a standard pitch connector system widely used in industrial and automotive sectors. As a header component, it serves as the stationary interface paired with cable assemblies or backplanes, forming a complete interconnect system.
Compatible substitutes include other Harwin Datamate J-Tek headers with identical 4-position count and 2 mm pitch. Verify that alternative parts maintain the same through-hole termination style and straight orientation. Cross-reference mating receptacle part numbers to ensure mechanical and electrical interoperability without redesigning the host board footprint.