M80-8871201

Overview

The Harwin M80-8871201 is a Datamate J-Tek power-to-board connector featuring 12 positions (6+6) in a dual in-line configuration. It utilizes a 2.00 mm pitch and is designed for vertical through-hole mounting. The assembly includes female sockets with tin-lead contact finishes, rated for 800 V. Key mechanical specifications include mated stacking heights of 7.23 mm and 7.85 mm, ensuring compatibility within constrained board layouts.

Feature Summary

• Vertical orientation facilitates direct board-to-cable or board-to-board interconnection.
• High voltage rating supports demanding power distribution requirements.
• Dual in-line receptacle design ensures secure mating engagement.

Applications

• Automotive electronic systems
• General purpose industrial equipment
• Military grade hardware assemblies

Procurement Notes

Verify the specific tin-lead contact finish against environmental compliance regulations such as RoHS restrictions before finalizing procurement decisions. Confirm that the vertical mounting style aligns with the mechanical constraints of the target enclosure. Ensure that the 800 V rating meets the operational safety standards required for the intended application environment.

Selection Notes

Select this component when a vertical form factor is required to minimize footprint area on the printed circuit board. The high voltage capability makes it suitable for applications requiring significant electrical isolation between connected components. Consider the specific stacking height dimensions to ensure adequate clearance above adjacent board features.

Part Context

This part belongs to the Datamate J-Tek series by Harwin Inc., which specializes in compact, high-density interconnect solutions. The series is engineered for reliability in harsh environments, offering robust mechanical locking mechanisms alongside precise electrical performance characteristics suitable for critical infrastructure.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation.