MA-ZX2-10-2I-D9-R2

Overview

The Enclustra MA-ZX2-10-2I-D9-R2 is a Mars ZX2 System-on-Module (SoM) based on the AMD Zynq XC7Z010-2CLG400I All Programmable SoC. It integrates dual ARM Cortex-A9 cores, an Artix-7 FPGA fabric, 512MB DDR3L SDRAM, and 64MB quad SPI flash. The module features Gigabit Ethernet, USB 2.0 OTG, and a real-time clock within a compact SO-DIMM form factor measuring 67.6 x 30 mm. Designed for industrial applications, it operates in the -40°C to +85°C temperature range using a single 3.3V supply.

Feature Summary

• AMD Zynq XC7Z010-2CLG400I SoC with dual ARM Cortex-A9 processors
• 512MB DDR3L SDRAM and 64MB Quad SPI Flash memory
• Integrated Gigabit Ethernet PHY and USB 2.0 On-The-Go PHY
• Industrial temperature range (-40°C to +85°C) operation

Applications

• Embedded processing systems requiring space-saving hardware designs
• Industrial automation and control applications
• Communication devices utilizing Gigabit Ethernet and USB interfaces
• Prototyping platforms for Zynq-7000 SoC development

Procurement Notes

Verify the specific revision suffix 'R2' against the manufacturer's EN-number list to ensure compatibility with current documentation. Confirm that the baseboard utilizes a compatible 200-pin DDR2 SO-DIMM socket rated for 1.8V. Ensure proper ESD handling procedures are followed during installation to prevent damage to the sensitive FPGA components.

Selection Notes

Select this model when the specific logic resources of the XC7Z010 device are sufficient for the application requirements. Consider the MA-ZX2-20 variant if higher FPGA capacity or additional I/O pins are needed. Verify that the baseboard design supports the required voltage levels for the shared MIO and FPGA I/O banks, particularly regarding VCC_IO configurations.

Part Context

This module belongs to the Enclustra Mars family, which provides standardized SoM solutions for AMD Xilinx devices. The Mars ZX2 series specifically targets the Zynq-7000 architecture, offering a complete embedded system in an industry-standard SO-DIMM package. This allows for rapid integration into carrier boards while reducing redesign risks associated with custom PCB layouts.

Replacement Considerations

Direct replacement requires matching the SO-DIMM footprint and pinout. For increased performance, the MA-ZX2-20-2I-D9-R2 offers the same form factor but with the XC7Z020 device. Custom configurations may also be available directly from Enclustra for specific memory or interface requirements.