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MA4E1340A1-287T is listed in the RF Diode range at ChipApex. The manufacturer field lists MACOM Technology Solutions. Its product description is DIODE SCHOTTKY 70V 250MW SOT-23. Review the specifications below when checking this part for your BOM.
The MA4E1340A1-287T is a silicon medium barrier Schottky diode from the MACOM MA4E1340 series, housed in an SOT-23 (Case Style 287) surface mount package. It features a maximum reverse voltage of 70 V and a total capacitance of 2 pF maximum at 0 V bias. The device supports continuous forward currents up to 200 mA with a maximum power dissipation of 250 mW. Operating temperatures range from -55°C to +125°C. Electrical specifications include a forward voltage of 410 mV maximum at 1 mA and 1 V maximum at 15 mA.
Verify component authenticity by cross-referencing the manufacturer's part number and datasheet revision against authorized distribution channels. Confirm RoHS compliance status and specific ordering suffixes match project requirements. Ensure storage conditions adhere to the specified temperature ranges to maintain device integrity prior to assembly.
Select this component when a single Schottky diode configuration is required for medium barrier applications. The SOT-23 package provides a compact footprint for space-constrained designs. Consider alternative series pair or unconnected pair configurations if circuit topology demands matched diode characteristics or differential signaling capabilities.
This component belongs to the MA4E1340 series of silicon medium barrier Schottky diodes manufactured by MACOM Technology Solutions. The series offers multiple package options including SOT-23, SOT-323, SC-79, and SOD-323. The 'A' designation indicates a single diode configuration, while 'B' denotes a series pair. The '1' suffix specifies the SOT-23 case style.
Direct substitutes within the same series include MA4E1340A1-1146T (SOT-323), MA4E1340A1-1141T (SOD-323), and MADS-001340-12790T (SC-79). These alternatives share identical electrical characteristics but differ in physical package dimensions and pinout orientation.
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