MAAT-011022-DIE

Overview

The MAAT-011022-DIE is a bare die fixed RF attenuator from MACOM Technology Solutions, designed for chip-and-wire assemblies. It operates across a frequency range of 0 Hz to 50 GHz with a standard 50 Ohm impedance. The component provides a fixed attenuation value of 22 dB and supports a maximum power handling capacity of 27 dBm. This integrated circuit is engineered to deliver flat attenuation characteristics and excellent return losses within its specified bandwidth.

Feature Summary

• Wide bandwidth operation extending up to 50 GHz
• Fixed attenuation values available in multiple steps including 22 dB
• Designed for small form factor SMT applications
• Optimized for flat attenuation and good return losses

Applications

• Chip-and-wire assemblies
• RF signal conditioning circuits
• High-frequency test and measurement equipment

Procurement Notes

Verify the specific part number suffix against official MACOM documentation to confirm the exact attenuation value and package configuration. Ensure that the procurement source provides authentic components from authorized channels. Confirm that the bare die format aligns with your assembly capabilities before ordering.

Selection Notes

Select this component when a compact, high-frequency attenuator is required for board-level integration. The 50 Ohm impedance matches standard RF systems. Consider the 27 dBm power handling limit for signal levels. Verify thermal management requirements for bare die mounting in the final design.

Part Context

This device belongs to the MAAT-0110xx-DIE series of fixed attenuators. The series offers various attenuation steps such as 2, 3, 4, 6, 10, 15, and 20 dB. These components are specifically tailored for applications demanding small size and consistent performance in the microwave and millimeter-wave spectrum.

Replacement Considerations

Check the MAAT-0110xx-DIE series for alternative attenuation values if the 22 dB specification does not match the design requirement. Other models in the series provide different fixed attenuation steps while maintaining similar electrical characteristics and package form factors.