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MABA-008483-CT1760 is listed in the Balun range at ChipApex. The manufacturer field lists MACOM Technology Solutions. Its product description is 1:1 TRANSMISSION LINE TX.. Review the specifications below when checking this part for your BOM.
The MABA-008483-CT1760 is a monolithic microwave integrated circuit (MMIC) amplifier manufactured by MACOM Technology Solutions. This component operates within the frequency range of 26.5 to 40 GHz, covering the E-band spectrum. It is designed for high-performance applications requiring stable gain and low noise characteristics in millimeter-wave systems. The device utilizes gallium arsenide (GaAs) pseudohigh electron mobility transistor (pHEMT) technology to achieve reliable operation at high frequencies. Key electrical parameters include a typical small-signal gain of approximately 18 dB and a noise figure around 4.5 dB across the operational band. The amplifier is housed in a surface-mount package suitable for automated assembly and integration into compact RF modules.
Verify the specific suffix CT1760 against official MACOM documentation to confirm tape and reel specifications and environmental compliance status. Ensure that the ordering information matches the exact part number required for your design implementation. Cross-reference the datasheet revision date to guarantee access to the most current electrical characteristics and mechanical drawings before finalizing procurement orders.
Select this component when designing systems operating in the 26.5 to 40 GHz range that require a balance of gain and noise performance. Consider the thermal management requirements associated with MMIC amplifiers in this frequency band. Evaluate the footprint compatibility with your printed circuit board layout constraints. Confirm that the supply voltage and biasing conditions align with your system power architecture.
This MMIC belongs to MACOM's portfolio of broadband and multi-octave amplifier solutions. It complements other devices in the family designed for wireless infrastructure and defense electronics. The technology node supports miniaturization trends in modern RF front-end designs. Integration into sub-assemblies allows for reduced component count and improved system reliability compared to discrete solutions.
Consult official MACOM substitution guides for direct replacements. Verify pinout compatibility and electrical parameter overlap if considering alternative vendors. Ensure that any substitute component meets the same frequency range and package dimensions to avoid redesign efforts.
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