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MAC15-008 is listed in the Triacs range at ChipApex. The manufacturer field lists onsemi. Its product description is TRIAC 600V 15A TO220AB. Review the specifications below when checking this part for your BOM.
The MAC15-008 is a silicon-controlled rectifier (SCR) from onsemi, designed for general-purpose switching applications. It features an 800V repetitive peak reverse voltage and a holding current of 25mA. The device is housed in a DO-214AC (SMB) surface-mount package, providing robust thermal performance and mechanical stability. With a non-repetitive peak forward current capability of 30A, it supports transient load conditions effectively. The gate trigger voltage is specified at a maximum of 1.3V, ensuring reliable turn-on characteristics under standard drive conditions.
Verify the specific ordering suffix to confirm exact electrical tolerances and packaging details. Ensure the component matches the required voltage and current ratings for the target circuit design. Cross-reference the manufacturer's latest datasheet for any updates on pin configurations or thermal resistance values before finalizing procurement specifications.
Select this component based on its 800V blocking capability and SMB package constraints. Evaluate the thermal management requirements given the surface-mount form factor. Confirm that the gate drive circuitry can supply sufficient current to meet the specified trigger parameters reliably under all operating temperature ranges.
This SCR belongs to onsemi's family of high-voltage silicon-controlled rectifiers intended for industrial and consumer electronics. The SMB package allows for compact board layouts while maintaining adequate heat dissipation for moderate power applications. It serves as a direct replacement for legacy through-hole devices where space savings are critical.
Check for equivalent part numbers from other manufacturers offering identical 800V ratings and SMB packages. Verify pinout compatibility and thermal resistance values to ensure seamless integration without redesigning the PCB layout or cooling infrastructure.
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