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MADP-042305-13060P is listed in the RF Diode range at ChipApex. The manufacturer field lists MACOM Technology Solutions. Its product description is RF DIODE PIN 80V DIE. Review the specifications below when checking this part for your BOM.
The MADP-042305-13060P is a silicon glass PIN diode surmount chip utilizing MACOM’s HMIC process. It features two silicon pedestals embedded in low-loss glass with selective backside metallization for surface mounting. The device provides exceptional heat transfer and is encapsulated with silicon nitride and polymer protection. Electrical specifications at +25°C include a typical capacitance of 0.14 pF at -10 V, 1 MHz; series resistance of 1.32 Ω at +20 mA, 1 GHz; forward voltage of 0.87 V at +10 mA; reverse leakage current maximum of 10 µA at -80 V; input third-order intercept point of 72 dBm; CW thermal resistance of 145 °C/W; and lifetime of 180 ns.
Verify the specific ordering suffix against official documentation to confirm packaging configuration. The 'P' suffix indicates pocket tape packaging, while other suffixes may denote different reel types. Confirm RoHS compliance status and ensure handling procedures account for static sensitivity during assembly.
Select this component for designs requiring high average and peak power handling capabilities. Consider the low parasitic inductance of 0.4 nH when comparing against plastic package counterparts for higher frequency switch applications. Ensure the circuit layout accommodates the ODS-1306 style dimensions and utilizes recommended soldering techniques for hard or soft substrates.
This part belongs to the MADP-042XX5-13060 Series of SURMOUNT PIN Diodes. Other variants in this series include the MADP-042405, MADP-042505, and MADP-042905 models, which share similar physical dimensions but differ in electrical characteristics such as capacitance and resistance values.
Direct substitutes within the same series include MADP-042405-13060P, MADP-042505-13060P, and MADP-042905-13060P. Verify that the alternative model's electrical parameters meet the specific circuit requirements before substitution.
The absolute maximum CW incident power rating for the MADP-042305 is 40 dBm.
The topside is fully encapsulated with silicon nitride and includes an additional polymer layer to provide moisture, scratch, and impact protection for the junction and anode air-bridge.
Mounting temperature should not exceed +280°C for 10 seconds. Use of 80Au/20Sn or RoHS compliant solders is recommended, with hot gas die bonding preferred for hard substrates.
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