MADP-042308-130600

RF Diode Overview

The MADP-042308-130600 is a silicon glass PIN diode surmount chip from the MADP-042xx8-1306x series, fabricated using MACOM's HMIC process. It features two silicon pedestals embedded in low-loss glass with selective backside metallization for surface mount attachment. The device provides exceptional heat transfer and includes silicon nitride passivation with polymer scratch protection. Electrical specifications at +25°C include a typical capacitance of 0.10 pF at -10V/1MHz and 0.10 pF at -10V/1GHz. Series resistance is typically 1.38 Ω at 20 mA/1GHz and 1.18 Ω at 50 mA/1GHz. Forward voltage is typically 0.85 V at +10 mA. Reverse leakage current is limited to 10 µA at -100 V. Input third-order intercept point is typically 73 dBm. CW thermal resistance is typically 145 °C/W.

RF Diode Feature Summary

• Surface mount packageless design utilizing rugged silicon-glass construction
• Vertical topology providing exceptional heat transfer capabilities
• Encapsulated topside with silicon nitride and polymer layers for junction protection
• Low parasitic inductance of 0.4 nH suitable for high-frequency switching

RF Diode Applications

• Moderate incident power applications up to 10 W continuous wave
• High frequency switch elements requiring low parasitic inductance
• Peak power handling scenarios with pulse widths ≤1 μs and duty cycles ≤0.01%

RF Diode Procurement Notes

Verify the specific ordering suffix against the manufacturer datasheet to confirm packaging configuration. The datasheet indicates that the '00' suffix corresponds to Gel Pack Tape and Reel (Pocket Tape) format. Confirm RoHS compliance status and ensure compatibility with recommended soldering materials such as 80Au/20Sn or compliant alternatives during procurement planning.

RF Diode Selection Notes

Select this component when low parasitic capacitance and inductance are critical for high-frequency performance compared to plastic packaged counterparts. Evaluate the CW thermal resistance and peak power handling limits against system requirements. Ensure the operating temperature range of -55°C to +125°C aligns with environmental conditions. Consider the surface mount bonding techniques for integration into hard or soft substrates.

RF Diode Part Context

This part belongs to the MADP-042xx8-1306x series of Surmount 8 µM PIN diodes. The series includes variants like MADP-042408, MADP-042508, and MADP-042908, which share the same physical outline dimensions but differ in electrical characteristics such as capacitance and resistance. The technology utilizes patented HMIC fabrication for robust surface mount implementation.

RF Diode Replacement Considerations

Direct replacements within the same series include MADP-042408, MADP-042508, and MADP-042908. These parts share identical mechanical dimensions but exhibit different electrical parameters. Verify that the alternative part's capacitance, resistance, and power handling ratings meet the specific circuit requirements before substitution.