MADP-042505-13060P

RF Diode Overview

The MADP-042505-13060P is a silicon glass PIN diode surmount chip from the MADP-042XX5-13060 series, fabricated using MACOM’s HMIC process. It features two silicon pedestals embedded in low-loss glass with selective backside metallization for surface mount attachment. Electrical specifications at +25°C include a typical capacitance of 0.22 pF at -10 V/1 GHz and 0.27 pF at -40 V/1 GHz. Series resistance is typically 0.83 Ω at +20 mA/1 GHz and 0.76 Ω at +50 mA/1 GHz. Forward voltage is typically 0.84 V at +10 mA, with reverse leakage current limited to 10 µA at -80 V. The device exhibits a typical IIP3 of 76 dBm and CW thermal resistance of 115 °C/W.

RF Diode Feature Summary

• Surface mount packageless design utilizing rugged silicon-glass construction with silicon nitride passivation and polymer scratch protection.
• Vertical topology with electrically conductive pedestal sidewalls providing exceptional heat transfer capabilities.
• Low parasitic inductance and excellent RC constant suitable for higher frequency switch elements compared to plastic packages.

RF Diode Applications

• Moderate incident power applications up to 10 W CW or peak power ≤50 W with pulse width ≤1 μs and duty cycle ≤0.01%.
• Higher frequency switch elements requiring low parasitic inductance (0.4 nH) and superior RC constants.

RF Diode Procurement Notes

Verify component authenticity through authorized MACOM distributors or direct manufacturer channels. Confirm RoHS compliance status and check for specific lot traceability requirements relevant to your manufacturing standards. Ensure handling procedures adhere to ESD control techniques due to static sensitivity. Review datasheet revision history for any updates to electrical parameters or mounting instructions prior to final procurement orders.

RF Diode Selection Notes

Select this component when moderate incident power handling is required alongside high-frequency switching performance. Compare capacitance and series resistance values against circuit requirements at specific bias voltages and frequencies. Consider the thermal resistance specification for heat dissipation planning in dense layouts. Evaluate the surface mount compatibility with hard or soft substrates based on available assembly equipment and soldering profiles.

RF Diode Part Context

This part belongs to the MADP-042XX5-13060 series of SURMOUNT PIN diodes, which includes variants like MADP-042305, MADP-042405, and MADP-042905. These devices share the same ODS-1306 outline dimensions but differ in electrical characteristics such as capacitance and resistance. The series utilizes the patented HMIC process for robust surface mount integration without wirebonds.

RF Diode Replacement Considerations

Direct substitutes within the same series include MADP-042305-13060P, MADP-042405-13060P, and MADP-042905-13060P. Verify that alternative parts meet the specific capacitance, resistance, and power handling requirements of the original design before substitution.

RF Diode FAQ

What is the maximum reverse voltage rating for the MADP-042505-13060P?

The absolute maximum reverse voltage rating is -80 V.

How is the junction protected during handling and assembly?

The topside is fully encapsulated with silicon nitride and an additional polymer layer to provide moisture, scratch, and impact protection for the junction and anode air-bridge.

What is the recommended mounting method for these devices?

Attachment is made via surface mount technology using solder pads on the bottom surface. Hot gas die bonding is preferred for hard substrates, while soft solder is recommended for soft substrates like Duroid.