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MAF0603FAL330BT000 is listed in the Chip Ferrite Bead range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is FERRITE BEAD 33 OHM 0201 1LN. Review the specifications below when checking this part for your BOM.
The MAF0603FAL330BT000 is a single-channel common mode filter manufactured by TDK Corporation, designed for surface-mount PCB assembly. It features an impedance of 33 Ohms with a tolerance of 25%, tested at a frequency of 100 MHz. The component supports a maximum DC current of 200 mA and has a maximum DC resistance of 700 mOhms. It operates within a temperature range of -55°C to +125°C. The device is housed in a compact 0201 (0603 metric) package with dimensions of 0.6 mm length, 0.3 mm width, and 0.3 mm height.
Verify the specific RoHS compliance status and detailed datasheet requirements before procurement. Confirm that the 0201 package dimensions align with your PCB footprint design. Ensure the 200 mA current rating meets your circuit's operational demands. Check for any specific handling or storage conditions required for this SMD component type.
Select this component when a compact 0201 form factor is required for high-frequency noise attenuation. The 33 Ohm impedance value is suitable for specific signal line filtering applications. Consider the 200 mA current limit and 700 mOhm resistance for power integrity analysis. Verify compatibility with automated pick-and-place processes due to the small package size.
This part belongs to the TDK MAF series of common mode chokes and filters. It is categorized under EMC filters and noise suppression components. The series offers various impedance values and package sizes for different filtering needs. This specific model focuses on providing effective interference reduction in space-constrained commercial electronics.
Consult official TDK documentation for verified substitute part numbers within the MAF series. Ensure any replacement maintains the same 0201 package dimensions and 33 Ohm impedance characteristics. Verify that alternative components meet the same thermal and current specifications for direct integration.
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