— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:RF ATTENUATOR 7DB DIE
- Series:-
- Mfr:MACOM Technology Solutions
- Package:Tray
- Attenuation Value:7dB
- Frequency Range:0 Hz ~ 20 GHz
- Power (Watts):2W
- Impedance:-
- Grade:-
- Qualification:-
- Package / Case:Die
Download product information
Overview
The MAT10070 is a fixed RF attenuator die manufactured by MACOM Technology Solutions. It provides a nominal attenuation value of 7dB across a frequency range extending from 0 Hz to 40 GHz. The component is designed for medium power handling, supporting up to 2W of continuous wave power. Fabricated using advanced thin-film metallization and photolithography techniques, the device features a gold-plated surface for reliable bonding. It includes a metalized backside with grounding wraps at all four corners to facilitate efficient thermal and electrical connection without additional ground straps.
Feature Summary
- Thin-film construction utilizing advanced photolithography for high precision
- Integrated corner grounding wraps eliminate need for extra ground connections
- Gold-plated input and output pads enable standard wire bonding
- Metalized backside supports direct mounting via conductive epoxy or solder preforms
Applications
- Radar systems
- Satellite navigation equipment
- Aerospace electronics
- Custom 5G infrastructure
Procurement Notes
Verify that the specific procurement order matches the exact part number MAT10070 to ensure the correct 7dB attenuation specification. Confirm compatibility with the intended application frequency range up to 40 GHz. Ensure handling procedures account for the bare die format, requiring appropriate wire bonding and mounting techniques such as conductive epoxy or solder preforms for proper installation.
Selection Notes
Select this component when a fixed 7dB attenuation is required in wideband applications up to 40 GHz. Consider its 2W power handling capability for medium-power signal paths. The bare die format necessitates custom PCB design or carrier substrates suitable for wire bonding. Evaluate thermal management requirements due to the chip-level packaging and verify that the system can accommodate the physical dimensions of .030” x .030”.
Part Context
The MAT10070 belongs to the MAT10yyy series of thin-film attenuator pads from MACOM. This series utilizes state-of-the-art thin-film metallization and advanced photolithography. The devices are characterized by excellent temperature stability with a TCR less than 100 PPM. They offer flat response characteristics from DC to 20 GHz and are available in various attenuation values within the same package footprint.
Replacement Considerations
Direct substitutes within the same series include MAT10060 (6dB) and MAT10080 (8dB). Other variants in the MAT100xx series may be considered if different attenuation levels are acceptable. Ensure any replacement maintains the same die size and pinout configuration for mechanical compatibility.
ChipApex | Global Electronic Components Supplier









