MAT10130

MAT10130

$8.98
  • Description:RF ATTENUATOR 13DB DIE
  • Series:-
  • Mfr:MACOM Technology Solutions
  • Package:Tray

SKU:8541f5e65282 Category: Brand:

  
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Product Detailed Parameters

  • Description:RF ATTENUATOR 13DB DIE
  • Series:-
  • Mfr:MACOM Technology Solutions
  • Package:Tray
  • Attenuation Value:13dB
  • Frequency Range:0 Hz ~ 20 GHz
  • Power (Watts):2W
  • Impedance:-
  • Grade:-
  • Qualification:-
  • Package / Case:Die

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MAT10130

Overview

The MAT10130 is a thin-film RF attenuator die manufactured by MACOM Technology Solutions. It provides a nominal attenuation of 13dB with a tolerance of ±0.4dB. The component operates across a frequency range from DC to 20 GHz, with some sources indicating capability up to 40 GHz. It supports a maximum power handling of 2 Watts and utilizes advanced thin-film metallization and photolithography for fabrication.

Feature Summary

  • Utilizes state-of-the-art thin-film metallization and advanced photolithography processes for precise resistance control.
  • Designed as a bare die component intended for PCB mount integration in high-frequency circuits.
  • Provides stable attenuation performance across a wide microwave frequency spectrum.

Applications

  • Microwave communication systems requiring precise signal level adjustment
  • Test and measurement equipment needing calibrated attenuation stages
  • Radar systems utilizing high-frequency signal processing

Procurement Notes

Verify the specific datasheet version and electrical characteristics directly with MACOM or authorized distributors before procurement. Confirm that the application environment supports bare die mounting requirements, including thermal management and mechanical protection. Ensure compatibility with the target substrate material and assembly process specifications defined in the official documentation.

Selection Notes

Select this component when a fixed 13dB attenuation value is required within a compact form factor. Consider the 2W power handling limit relative to the expected signal levels in the circuit. Evaluate the need for bare die integration versus packaged alternatives based on board space constraints and manufacturing capabilities for chip-scale components.

Part Context

This part belongs to the MACOM thin-film attenuator series, which employs proprietary metallization techniques to achieve consistent performance. These chips are designed for integration into larger RF modules where space efficiency and high-frequency stability are critical design parameters.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided data. Consult MACOM engineering for potential equivalents if this specific die is unavailable.

FAQ

What is the maximum power handling capacity of the MAT10130?

The MAT10130 supports a maximum power handling of 2 Watts.

Does the MAT10130 come in a standard package?

No, it is supplied as a bare die intended for direct PCB mount integration.

MAT10130MAT10130
$8.98
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