MAT10180

Overview

The MAT10180 is a fixed RF attenuator die manufactured by MACOM Technology Solutions. It provides an attenuation value of 18 dB with a frequency range extending from DC to 20 GHz. The component supports a power handling capacity of 2W CW and operates at a standard impedance of 50 Ohms. Fabricated using thin film technology, it features a compact chip size of 0.030 inches by 0.030 inches (762 x 762 micrometers). The device exhibits excellent temperature stability with a TCR less than 100 PPM and includes a ground wrap design for simplified integration.

Feature Summary

• Thin film construction utilizing advanced photolithography for consistent performance
• Ground wrap structure eliminates the need for additional grounding bonds
• Flat response characteristics across the operational bandwidth
• High temperature stability ensuring reliable operation under thermal variations

Applications

• Radar systems
• Satellite navigation equipment
• Aerospace instrumentation
• Custom 5G infrastructure components

Procurement Notes

Verify that the specific order matches the MAT10180 designation to ensure correct attenuation levels. Confirm compatibility with existing PCB layouts regarding the 0.030-inch footprint. Ensure proper handling procedures are followed due to the bare die format. Validate that the application environment remains within the specified 2W power limits. Check datasheet revisions for any updates to mechanical or electrical specifications before finalizing procurement.

Selection Notes

Select this component when an 18 dB attenuation value is required within a DC to 20 GHz frequency range. Consider the 2W power handling capability for high-power signal paths. The thin film technology offers superior stability compared to other materials. Evaluate the ground wrap feature if minimizing assembly complexity is a priority. Ensure the system impedance aligns with the standard 50 Ohm specification for optimal performance.

Part Context

The MAT10180 belongs to the MAT10yyy series of fixed attenuator dies from MACOM. This series utilizes state-of-the-art thin film metallization and advanced photolithography techniques. Components in this family are provided as chips with metalized backside ground connections. The series covers various attenuation values while maintaining consistent physical dimensions and performance characteristics across different models.

Replacement Considerations

The MAT10180 may be substituted with other parts from the MAT10yyy series if different attenuation values are acceptable. Verify that replacement devices maintain the same 0.030-inch by 0.030-inch footprint. Ensure alternative components support the required 20 GHz frequency range and 2W power handling. Confirm that the ground wrap design is present to avoid redesigning the grounding scheme.