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MAX1245BEAP is listed in the Analog To Digital Converters (ADC) range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC ADC 12BIT SAR 20SSOP. Review the specifications below when checking this part for your BOM.
The MAX1245BEAP is a 12-bit successive-approximation analog-to-digital converter (ADC) featuring an integrated 8-channel multiplexer and track/hold circuit. It operates from a single +2.375V to +3.3V supply, supporting both unipolar and bipolar input configurations via software control. The device provides a 4-wire serial interface compatible with SPI, QSPI, and MICROWIRE protocols. It achieves a sampling rate of up to 100ksps using either an internal clock or an external serial clock. The component is housed in a 20-pin SSOP package and supports an operating temperature range of -40°C to +85°C.
Verify the specific suffix BEAP corresponds to the extended temperature range (-40°C to +85°C) and SSOP package. Confirm RoHS compliance status as historical records indicate variations between non-compliant and compliant versions for this part number. Check manufacturer documentation for end-of-life notices or obsolescence declarations before finalizing procurement plans.
Select the MAX1245BEAP when a 12-bit resolution and 100ksps sampling rate are required within a low-voltage, single-supply environment. Ensure the application utilizes a serial interface compatible with SPI or MICROWIRE standards. Verify that the system power budget accommodates the specified supply voltage range and that the thermal requirements align with the extended industrial temperature grade.
The MAX1245 belongs to a family of low-power, serial 12-bit ADCs designed for battery-operated applications. The BEAP variant specifically denotes the extended temperature range version packaged in a 20-pin SSOP format. This distinguishes it from the ACAP/BCAP variants which are limited to commercial temperature ranges, and the DIP package alternatives like AEPP/BEPP.
The MAX1245AEPP+ is listed as a direct substitute offering pin compatibility and similar electrical characteristics in a PDIP package. Verify that the package change from SSOP to DIP meets the mechanical constraints of the target design.
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