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MAX13085ECSA+T is listed in the Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC TRANSCEIVER 1/1 8SOIC. Review the specifications below when checking this part for your BOM.
The MAX13085ECSA+T is a half-duplex RS-485 transceiver manufactured by Analog Devices Inc./Maxim Integrated. It integrates one driver and one receiver, operating from a single +5.0V supply with a voltage range of 4.5V to 5.5V. The device supports data rates up to 500kbps and features ±15kV ESD protection on I/O pins. It includes fail-safe circuitry that guarantees a logic-high receiver output when inputs are open or shorted. Hot-swap capability prevents false transitions during power-up or insertion. The typical supply current is 1.8mA, and it operates within an extended temperature range of -40°C to +85°C in an 8-pin SO package.
Verify the specific suffix 'C' indicates commercial temperature range availability against official documentation. Confirm the '+T' designation corresponds to tape-and-reel packaging requirements for automated assembly processes. Ensure the component matches the exact manufacturer part number to avoid compatibility issues with existing designs.
Select this model for applications requiring half-duplex communication with moderate speed requirements up to 500kbps. The integrated hot-swap feature makes it suitable for systems requiring board insertion while powered. Verify that the 8-pin SO package dimensions fit the available PCB footprint constraints before finalizing the design.
This component belongs to the MAX13080E–MAX13089E family of +5.0V, ±15kV ESD-protected RS-485 transceivers. The family shares common architectural features such as fail-safe receivers and low-power shutdown modes. Specific variants differ primarily in duplex mode, maximum data rate capabilities, and pin-selectable features like slew rate control.
Direct functional substitutes within the same series include the MAX13082ECSA+T and MAX13088ECSA+T, which also provide half-duplex operation. When replacing, verify that the thermal dissipation characteristics and package outline dimensions remain compatible with the original layout.
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