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MAX1487CUA is listed in the Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC TRANSCEIVER HALF 1/1 8MAX. Review the specifications below when checking this part for your BOM.
The MAX1487CUA is a low-power, half-duplex RS-422/RS-485 transceiver manufactured by Analog Devices Inc./Maxim Integrated. It integrates one driver and one receiver within an 8-pin TSSOP package. The device supports data rates up to 2.5 Mbps and operates on a single 5 V supply with a quiescent current of 300 µA. It features slew-rate limiting to minimize electromagnetic interference (EMI) and includes 15 kV ESD protection on the bus pins. The component is rated for an industrial operating temperature range from -40°C to +85°C.
Verify the specific suffix 'CUA' corresponds to the 8-TSSOP package variant when sourcing. Confirm RoHS compliance status through official manufacturer documentation or authorized distributor declarations prior to procurement. Ensure the supplier provides traceable origin records to maintain quality assurance standards for industrial applications.
Select this component for designs requiring reliable half-duplex communication at moderate speeds with strict power constraints. The integrated ESD protection simplifies board-level design by reducing the need for external protection devices. Verify that the system voltage aligns with the specified 5 V operation and that the thermal requirements fit within the TSSOP package capabilities.
This part belongs to the MAX1487 family of low-power RS-485/RS-422 transceivers. The family is characterized by its ability to operate with minimal power consumption while maintaining compatibility with standard RS-485 protocols. The CUA suffix specifically denotes the thin-shrink small-outline package, distinguishing it from other pinout configurations in the series.
Direct replacements include the MAX1487EESA+ and MAX1487CSA+. These variants share identical electrical specifications but differ in packaging; ensure the PCB footprint matches the selected alternative's physical dimensions before substitution.
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