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MAX16006ETG+T is listed in the Supervisors range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC SUPERVISOR 8 CHANNEL 24TQFN. Review the specifications below when checking this part for your BOM.
The MAX16006ETG+T is a low-voltage supervisory circuit manufactured by Analog Devices Inc. (Maxim Integrated). It features an adjustable threshold voltage and supports up to eight monitored inputs. The device provides active-low, open-drain outputs and includes manual reset functionality with a fixed reset delay time of 200 ms. It incorporates a watchdog timer and operates within a supply voltage range of up to 5.5 V. The component is designed for surface-mount installation in TQFN-24 packages, ensuring reliable performance across industrial temperature ranges.
Verify the specific suffix 'T' indicates tape-and-reel packaging when sourcing. Confirm RoHS compliance status through official manufacturer documentation prior to procurement. Ensure the selected variant matches the required package type and thermal specifications for the intended application environment.
Select this component when multi-rail supervision is required in compact designs. Consider the adjustable threshold feature for custom voltage monitoring needs. Evaluate the TQFN-24 package for space-constrained PCB layouts. Verify compatibility with the system's operating temperature range and supply voltage constraints before integration.
This part belongs to the MAX16006 series of microprocessor supervisors. It is distinct from other Maxim Integrated ICs by its specific combination of quad/hex/octal monitoring capabilities and integrated watchdog functionality. The ETG+ designation identifies the lead-free, green plastic package variant suitable for modern manufacturing processes.
Check for direct cross-reference part numbers from Analog Devices or Maxim Integrated. Verify pinout compatibility and electrical parameter alignment if substituting with similar supervisory circuits. Ensure any alternative maintains the same package footprint and thermal characteristics.
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