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MAX1711EEG+TG002
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Product Detailed Parameters
- Description：INTEGRATED CIRCUIT
- Series：-
- Mfr：Analog Devices Inc./Maxim Integrated
- Package：Bulk
- Applications：-
- Voltage - Input：-
- Number of Outputs：-
- Voltage - Output：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
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Overview
The MAX1711EEG+TG002 is a step-down controller designed for core CPU DC-DC converters in notebook computers. It features a triple-threat combination of high efficiency, fast transient response, and compact solution size. The device integrates power MOSFETs and control logic to simplify design. It operates with an input voltage range suitable for battery-powered applications. The component supports multiple output configurations for complex processor power requirements.
Feature Summary
- Integrated power MOSFETs for simplified board layout
- Optimized for notebook computer core CPU power conversion
- Fast transient response capability
- High switching efficiency
Applications
- Notebook computer core CPU DC-DC converters
- Portable computing device power management
- Battery-operated system voltage regulation
Procurement Notes
Verify the exact suffix TG002 against official Analog Devices documentation to confirm pinout and thermal characteristics. Ensure compatibility with existing PCB footprints. Confirm RoHS compliance status through manufacturer declarations. Validate that the component matches the specific application voltage and current requirements before procurement.
Selection Notes
Select this component when designing power stages for notebook CPUs requiring integrated switching elements. Consider the thermal performance of the EG package. Evaluate the need for external compensation components based on the load profile. Compare against alternative controllers if higher current capacity or different input voltage ranges are required.
Part Context
This part belongs to the MAX1710/MAX1711 family of step-down controllers from Maxim Integrated, now part of Analog Devices. These devices were widely used in mobile computing platforms during their production lifecycle. The EG package denotes a specific surface-mount configuration optimized for thermal dissipation in portable electronics.
Replacement Considerations
Check for direct pin-to-pin replacements within the MAX171x series. Verify functional equivalence with newer generations of CPU power controllers. Ensure substitute parts support the same input voltage range and output current capabilities.
