MAX1714BEEE-TG074

Overview

The MAX1714BEEE-TG074 is a high-speed step-down controller from Analog Devices Inc./Maxim Integrated, part of the Quick-PWM series. It features a single-output regulator with a maximum output voltage of 20V and supports output voltages as low as 1V. The device offers high accuracy of ±1.5% and a low dropout voltage of max 350 mV. It is housed in a 20-SSOP package (0.154", 3.90mm Width). Designed for processor core applications, it utilizes Quick-PWM architecture for high efficiency.

Feature Summary

• Quick-PWM architecture for high efficiency
• Single-output regulator with 20-V maximum output voltage
• High accuracy (±1.5%) and low dropout voltage (max 350 mV)

Applications

• Processor core power supplies

Procurement Notes

Verify the manufacturer designation as Analog Devices Inc./Maxim Integrated. Confirm the package type is 20-SSOP (0.154", 3.90mm Width). Ensure the suffix TG074 corresponds to the specific tape-and-reel configuration if required. Cross-reference the RoHS status and lead times with authorized distributors or Rochester Electronics channels for availability confirmation.

Selection Notes

Select this component when a high-speed step-down controller with Quick-PWM architecture is needed. It is suitable for applications requiring a single output up to 20V and low dropout performance. The ±1.5% accuracy makes it appropriate for sensitive loads like processor cores. Consider the 20-SSOP package constraints for PCB layout.

Part Context

This part belongs to the MAX1714 family of special purpose regulators under the Quick-PWM series. It is categorized as a PMIC - Switching Controller. The MAX1714BEEE variant is the base model, with the TG074 suffix indicating specific packaging or reel specifications. It serves as a dedicated solution for efficient DC-DC conversion in embedded systems.

Replacement Considerations

Compare with MAX1714BEEE+ and MAX1714BEEE+T. Verify that the functional specifications match, particularly the Quick-PWM architecture and output voltage range. Ensure the package dimensions are compatible with the existing footprint.