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Product Detailed Parameters
- Description：CDMA CELLULAR/PCS SYSTEM POWER
- Series：-
- Mfr：Analog Devices Inc./Maxim Integrated
- Package：Bulk
- Applications：Cellular, CDMA Handset
- Current - Supply：367µA
- Voltage - Supply：2.5V ~ 5.5V
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：20-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Supplier Device Package：20-TSSOP-EP
- Grade：-
- Qualification：-
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Overview
The MAX1798EUP is a specialized Power Management IC (PMIC) designed for CDMA cellular and PCS handset applications. It integrates multiple power supply functions into a single package to reduce system complexity. The device operates within a voltage range of 2.5V to 5.5V and features a typical supply current of 367µA. It supports surface-mount installation in a 20-TSSOP package with an exposed pad, suitable for operating temperatures between -40°C and 85°C.
Feature Summary
- Integrates multiple power supply rails for CDMA cellular and PCS systems
- Optimized for low power consumption in handheld mobile devices
- Supports surface-mount technology in a compact 20-TSSOP package
Applications
- CDMA cellular handsets
- PCS system power supplies
- Mobile communication devices requiring integrated power management
Procurement Notes
Verify component authenticity through authorized channels due to obsolete status. Confirm package integrity and pin alignment against the 20-TSSOP specification. Review datasheet revisions for any design-in changes. Ensure storage conditions meet manufacturer guidelines to prevent moisture damage prior to reflow soldering.
Selection Notes
Select this component for legacy CDMA and PCS handset designs requiring integrated power management. Evaluate compatibility with existing board layouts due to the specific 20-TSSOP footprint. Consider end-of-life implications for long-term production support when integrating this PMIC into new or maintained product lines.
Part Context
The MAX1798EUP belongs to the MAX1798 series of specialized PMICs from Analog Devices/Maxim Integrated. These components are engineered specifically for mobile phone applications, consolidating various power rails to minimize board space. The EUP suffix indicates a TSSOP package variant within this family.
Replacement Considerations
The part status is listed as Obsolete. No public confirmed substitute part numbers are available in the provided documentation. Designers should consult official obsolescence notices for recommended replacement strategies.
