MAX1799EUP-TG068

MAX1799EUP-TG068

$2.66
  • Description:CDMA CELLULAR/PCS SYSTEM POWER
  • Series:-
  • Mfr:Analog Devices Inc./Maxim Integrated
  • Package:Bulk

SKU:b21e51c52e47 Category: Brand:

  
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Product Detailed Parameters

  • Description:CDMA CELLULAR/PCS SYSTEM POWER
  • Series:-
  • Mfr:Analog Devices Inc./Maxim Integrated
  • Package:Bulk
  • Applications:Cellular, CDMA Handset
  • Current - Supply:367µA
  • Voltage - Supply:2.5V ~ 5.5V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:20-TSSOP (0.173", 4.40mm Width) Exposed Pad
  • Supplier Device Package:20-TSSOP-EP
  • Grade:-
  • Qualification:-

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MAX1799EUP-TG068

Overview

The MAX1799EUP-TG068 is a specialized power management integrated circuit designed for CDMA cellular and PCS system applications. Manufactured by Analog Devices Inc./Maxim Integrated, it is housed in a 20-pin TSSOP package with an exposed pad (TSSOP-EP-20). The device operates within a supply voltage range of 3V to 5.5V and draws a typical supply current of 367µA. It features programmable temperature thresholds and supports I2C/SMBus interfaces for digital communication. The component is rated for operation between -40°C and +125°C, ensuring reliability in demanding mobile environments.

Feature Summary

  • Integrated power management solution optimized for CDMA cellular and PCS handset architectures
  • Digital interface compatibility with standard two-wire I2C and SMBus protocols
  • Programmable thermal monitoring capabilities with configurable threshold settings
  • Low quiescent current consumption to extend battery life in portable devices

Applications

  • CDMA cellular handset power systems
  • PCS system power supplies
  • Mobile phone battery management units
  • Portable electronic device thermal protection circuits

Procurement Notes

Verify the specific suffix TG068 against official Analog Devices documentation to confirm pinout and functional equivalence, as suffixes often denote tape-and-reel packaging or specific manufacturing lot codes rather than electrical differences. Confirm RoHS compliance status through the manufacturer's current datasheet revision. Due to potential lifecycle changes, validate availability and lead times directly with authorized distributors or the manufacturer before finalizing procurement plans.

Selection Notes

Select this component when designing power management subsystems for CDMA or PCS mobile handsets requiring integrated thermal monitoring. Ensure the design accommodates the 20-TSSOP exposed pad footprint for adequate thermal dissipation. Verify that the system logic levels are compatible with the I2C/SMBus interface voltages. Consider the 367µA supply current impact on overall standby power budgets in battery-operated applications.

Part Context

This part belongs to the Maxim Integrated power management portfolio, specifically targeting mobile communication devices. It integrates multiple functions typically handled by discrete components, reducing board space and complexity. The MAX1799 series is engineered to meet the stringent power efficiency and thermal management requirements of early-to-mid generation cellular phones.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult Analog Devices technical support for qualified alternatives if this component is discontinued or unavailable.

MAX1799EUP-TG068MAX1799EUP-TG068
$2.66
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