MAX1799EUP+T

MAX1799EUP+T

$2.38
  • Description:IC PWR SPLY CDMA 20-TSSOP
  • Series:-
  • Mfr:Analog Devices Inc./Maxim Integrated
  • Package:Tape & Reel (TR)

SKU:216aae688154 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC PWR SPLY CDMA 20-TSSOP
  • Series:-
  • Mfr:Analog Devices Inc./Maxim Integrated
  • Package:Tape & Reel (TR)
  • Applications:Cellular, CDMA Handset
  • Current - Supply:367µA
  • Voltage - Supply:2.5V ~ 5.5V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:20-TSSOP (0.173", 4.40mm Width) Exposed Pad
  • Supplier Device Package:20-TSSOP-EP
  • Grade:-
  • Qualification:-

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MAX1799EUP+T

Overview

The MAX1799EUP+T is a specialized power management integrated circuit (PMIC) designed for CDMA cellular and PCS system applications. Manufactured by Analog Devices Inc./Maxim Integrated, this component operates within a TSSOP-20 package. It functions as a single analog input solution to support diverse sensing applications, integrating DC/DC controller capabilities including SEPIC, step-down (buck), and step-up (boost) topologies.

Feature Summary

  • Integrates DC/DC controller functionality with SEPIC, buck, and boost conversion topologies
  • Features a single analog input architecture suitable for diverse sensing applications
  • Designed specifically for power supply requirements in CDMA cellular and PCS systems

Applications

  • CDMA cellular system power supplies
  • PCS system power management
  • Diverse sensing applications requiring integrated power control

Procurement Notes

Verify the specific suffix 'EUP' against official Analog Devices documentation to confirm the TSSOP-20 package and lead-free status. Ensure compatibility with CDMA/PCS design requirements. Cross-reference the manufacturer part number directly with datasheets to validate functional specifications before integration.

Selection Notes

Select this component when designing power systems for CDMA or PCS environments that require integrated buck, boost, and SEPIC control. The single analog input feature simplifies interface design for sensing applications. Confirm thermal performance and package constraints align with the target PCB layout and operating temperature range.

Part Context

This device belongs to the Maxim Integrated line of specialized power management ICs. It addresses the complex power distribution needs of mobile communication infrastructure. The integration of multiple converter types into a single package reduces component count and board space compared to discrete solutions.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.

MAX1799EUP+TMAX1799EUP+T
$2.38
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