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MAX186BEWP+T is listed in the ADCs/DACs - Special Purpose range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC DAS/ADC 12BIT 133K 20SOIC. Review the specifications below when checking this part for your BOM.
The MAX186BEWP+T is a low-power, 8-channel, serial 12-bit analog-to-digital converter (ADC) from Analog Devices/Maxim Integrated. It integrates an 8-channel multiplexer, high-bandwidth track/hold circuitry, and a successive-approximation register (SAR) architecture. The device operates on a single +5V or dual ±5V supply, consuming 1.5mA in operating mode and under 10µA when powered down between conversions. It features an internal 4.096V reference, software-configurable unipolar/bipolar and single-ended/differential inputs, and a 4-wire serial interface compatible with SPI, QSPI, and MICROWIRE protocols. The part is housed in a 20-pin shrink small-outline package (SSOP).
Verify the 'E' suffix indicates the extended temperature range of -40°C to +85°C. Confirm the '+T' suffix corresponds to tape-and-reel packaging as specified in the ordering information. Ensure the component grade matches the required accuracy specifications for the application.
Select this model for applications requiring multi-channel signal acquisition with minimal power draw. The internal clock mode allows conversion speeds independent of the host processor's serial clock rate. Differential input modes require stable return-side signals within ±0.5LSB relative to AGND during conversion.
This component belongs to the MAX186/MAX188 family of low-power serial ADCs. The MAX186 variant includes an internal reference, whereas the MAX188 requires an external reference. The BEWP+T designation specifies the B-grade accuracy, extended temperature range, SOIC/SSOP package type, and reel packaging format.
The MAX186CCAP+ serves as a functional substitute within the same family, offering identical electrical characteristics but restricted to the commercial temperature range of 0°C to +70°C. Verify package compatibility and temperature requirements before substitution.
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