SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The MAX241EEAI+T is a single-supply RS-232 transceiver from the MAX202E–MAX213E family, manufactured by Analog Devices Inc./Maxim Integrated. It operates on a +5V supply (4.5V to 5.5V) and features four drivers and five receivers. The device supports data rates up to 120kbps with ±15kV ESD protection per Human Body Model. It includes an integrated charge pump requiring four 1μF external capacitors. The EE suffix indicates an extended temperature range of -40°C to +85°C. It utilizes a 28-pin SSOP package and incorporates low-power shutdown functionality.
Verify the component authenticity through authorized distribution channels or direct manufacturer engagement. Confirm that the specific ordering suffix matches the required package type and temperature grade. Ensure compliance with RoHS directives as indicated in the product documentation. Cross-reference the datasheet revision to confirm pinout and electrical characteristics align with design requirements before finalizing procurement orders.
Select this component when designing systems requiring robust RS-232 communication under harsh environmental conditions. The extended temperature range makes it suitable for industrial applications. Consider the 1μF capacitor requirement for the charge pump when evaluating board space constraints. Verify that the system voltage remains within the specified 4.5V to 5.5V range to ensure proper operation of the internal voltage converters.
This part belongs to the MAX202E–MAX213E family of RS-232 transceivers designed for single-supply operation. The MAX241 variant specifically provides four drivers and five receivers, offering higher channel density than standard two-driver counterparts. The 'E' designation signifies enhanced ESD protection capabilities compared to standard versions, while the 'EE' suffix denotes the extended industrial temperature rating.
The MAX241EWI+ serves as a pin-compatible alternative in a wide SOIC package. Both devices share identical electrical specifications and functional block diagrams. Designers should verify package dimensions and thermal dissipation characteristics when substituting between SSOP and SOIC footprints.