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MAX253EPA+ is listed in the Power Management - Specialized range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC XFRMR DRIVER RS485 8-DIP. Review the specifications below when checking this part for your BOM.
The MAX253EPA+ is a monolithic oscillator and power driver designed to provide isolated power for RS-485 or RS-232 data interfaces. It drives a center-tapped transformer primary from a 5V or 3.3V DC supply. The device operates within a supply voltage range of 2.5V to 6V, with an operating supply current of 450µA. It features a non-inverting configuration and delivers an output current of 1A. Power dissipation is rated at 471mW. The component functions reliably across a temperature range of -40°C to +85°C and is housed in an 8-PDIP package.
Verify the specific suffix 'EPA+' indicates the PDIP-8 package variant when sourcing. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Check for obsolescence notices as Maxim Integrated products may have limited lifecycle availability. Ensure the supplier provides genuine Analog Devices components to guarantee electrical performance specifications.
Select this component when a combined oscillator and driver solution is required for isolated serial communication. It eliminates external timing components by integrating the oscillator function. Consider the 1A output current capability for driving small transformers. Verify that the 8-PDIP package fits the target PCB layout constraints compared to surface-mount alternatives like the ESA variant.
The MAX253 belongs to the Maxim Integrated family of specialized PMICs focused on isolated communication interfaces. It simplifies design by combining oscillation and drive functions into a single monolithic IC. This integration reduces component count and board space compared to discrete solutions. The device is part of a broader portfolio supporting industrial and commercial serial data transmission standards.
The MAX253ESA- serves as a surface-mount alternative with similar electrical characteristics but in an SOIC-8 package. Verify pinout compatibility and thermal requirements when substituting between DIP and SMD packages. No direct functional equivalents are documented; consider redesigning if package changes impact isolation creepage distances.
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