MAX3072EAPA+

Overview

The MAX3072EAPA+ is a half-duplex RS-485 transceiver manufactured by Analog Devices Inc./Maxim Integrated. It operates from a single +3.3V supply and features one driver and one receiver. The device supports data rates up to 250kbps with reduced slew-rate drivers to minimize EMI. It includes ±15kV ESD protection, fail-safe circuitry, and hot-swap capability. Available in an 8-pin Plastic DIP package, it functions within a temperature range of -40°C to +85°C.

Feature Summary

• Hot-swap input structure on DE and RE pins prevents false transitions during bus insertion or power-up.
• Fail-safe receiver guarantees a logic-high output when inputs are open or shorted.
• Reduced slew-rate drivers minimize electromagnetic interference and reflections for error-free transmission.

Applications

• Industrial Control
• Telecom
• Security Systems

Procurement Notes

Verify the specific suffix 'PA' indicates the Plastic DIP package variant rather than the standard SOIC version. Confirm the 'E' designation corresponds to the industrial temperature range (-40°C to +85°C). Ensure compatibility with existing board layouts requiring through-hole mounting instead of surface-mount technology.

Selection Notes

Select this component for applications requiring robust half-duplex communication over twisted-pair lines. The reduced slew rate makes it suitable for noisy environments where EMI must be minimized. Verify that the system does not require full-duplex operation, as this model is dedicated to half-duplex protocols.

Part Context

This part belongs to the MAX3070E–MAX3079E family of +3.3V RS-485 transceivers. While sharing core features like ESD protection and fail-safe design, the MAX3072E specifically targets half-duplex applications with a fixed 250kbps maximum data rate, distinguishing it from higher-speed or full-duplex variants in the series.

Replacement Considerations

The MAX3072EASA+ serves as a direct functional equivalent in an 8-SOIC surface-mount package. Designers requiring the same electrical characteristics but needing a different footprint should verify pin-to-pin compatibility between the DIP and SOIC versions.