MAX3077EESA/V+T

Overview

The MAX3077EESA/V+T is a full-duplex RS-485 transceiver operating from a single 3.3V supply. It features one driver and one receiver with data rates up to 16Mbps. The device includes ±15kV ESD protection, fail-safe circuitry ensuring a logic-high output when inputs are open or shorted, and hot-swap capability to prevent false transitions during power-up. It operates within a temperature range of -40°C to +85°C and draws 1.5mA typical supply current.

Feature Summary

• Full-duplex communication architecture supporting high-speed data transmission
• Integrated fail-safe mechanism guarantees a logic-high receiver output under undefined input conditions
• Hot-swap input structure prevents erroneous bus transitions during board insertion or power cycling

Applications

• Industrial control systems
• Telecommunications equipment
• Security systems
• Lighting systems
• Instrumentation

Procurement Notes

Verify the specific suffix 'V+' against official documentation to confirm automotive qualification status and RoHS compliance. Confirm package dimensions match the SOIC-8 footprint requirements for your PCB layout. Ensure the ordering code matches the exact revision level required by your design specifications.

Selection Notes

Select this component for applications requiring full-duplex RS-485 communication at speeds up to 16Mbps. It is suitable for environments needing robust ESD protection and fail-safe behavior without shutdown mode functionality. Consider alternative models if half-duplex operation or lower power consumption via shutdown modes is required.

Part Context

This part belongs to the MAX3070E–MAX3079E family of 3.3V RS-485 transceivers. Unlike other members in the series that may offer slew-rate limiting or shutdown modes, the MAX3077E provides unrestricted driver slew rates for maximum speed while maintaining standard full-duplex functionality and industrial-grade reliability features.

Replacement Considerations

The ADM3077EARZ is a confirmed substitute offering identical electrical specifications and pinout compatibility. Verify thermal performance and package tolerance alignment before implementation.