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The MAX3222EIPWR is a dual-channel RS-232 transceiver manufactured by Texas Instruments, designed for data communication on personal computers and handheld devices. It operates from a single 3-V to 5.5-V supply and features two drivers and two receivers. The device supports data rates up to 120 kb/s with typical slew rates of 8 V/µs. It includes an integrated charge pump requiring only four 0.1-µF external capacitors. The IPWR variant utilizes a 20-pin TSSOP package. It offers ±15-kV ESD protection on RS-232 lines and operates within a temperature range of -40°C to +85°C.
Verify the specific suffix 'IPWR' confirms the 20-pin Thin Shrink Small Outline Package (TSSOP) and industrial temperature grade (-40°C to +85°C). Confirm RoHS compliance status as per the latest manufacturer documentation. Ensure the ordering part number matches the exact electrical grade 'E' specifications. Cross-reference the datasheet revision date to ensure compatibility with current design requirements.
Select this component when a dual-channel RS-232 interface is required with low standby current capabilities. The TSSOP-20 package suits space-constrained printed circuit board designs. Verify that the system supply voltage falls within the 3-V to 5.5-V range. Consider the 120 kb/s data rate limit against application throughput needs. Ensure external capacitor values match the charge pump requirements specified in the electrical characteristics table.
This part belongs to the MAX3222 family of multichannel RS-232 line drivers and receivers. It shares functional similarities with the MAX3222ECPWR but differs in package type. The IPWR designation specifically indicates the TSSOP footprint, distinguishing it from SOIC or CDIP variants. It serves as a direct replacement for older discrete RS-232 driver solutions in legacy hardware designs.
The MAX3222ECPWR offers identical electrical performance in a TSSOP-20 package. The MAX3222IDW provides the same functionality in a 20-pin SOIC package. Verify pinout compatibility before substitution. Check if the alternative package meets the thermal and mechanical constraints of the existing PCB layout.