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The MAX3223EUP+T is a dual-driver, dual-receiver RS-232 transceiver manufactured by Analog Devices Inc./Maxim Integrated. It operates from a single +3.0V to +5.5V supply and features an integrated charge pump requiring only 0.1µF capacitors for 3.3V operation. The device incorporates AutoShutdown technology, reducing supply current to 1µA when no valid signal is detected on receiver inputs for 30µs. It supports full-duplex communication with a guaranteed data rate of 120kbps and typical rates up to 235kbps. The component is housed in a 20-pin TSSOP package and functions within a temperature range of -40°C to +85°C.
Verify the specific suffix 'T' indicates tape-and-reel packaging rather than tube packaging when sourcing this part number. Confirm that the 'E' designation corresponds to the extended industrial temperature range of -40°C to +85°C. Ensure the '+'' suffix aligns with RoHS compliance requirements for your manufacturing process. Cross-reference the manufacturer's ordering information to validate availability and lead times for the specific reel quantity.
Select the MAX3223EUP+T when a dual-channel RS-232 interface is required with minimal external component count. This part is suitable for designs prioritizing low standby power through AutoShutdown functionality. Consider the 20-pin TSSOP footprint for space-constrained PCB layouts. Verify that the 120kbps guaranteed data rate meets the system's communication speed requirements before finalizing the design.
This component belongs to the MAX3221/MAX3223/MAX3243 family of +3V to +5.5V RS-232 transceivers. While the MAX3221 offers one driver/receiver and the MAX3243 provides three drivers and five receivers, the MAX3223 specifically provides two drivers and two receivers. All members of this family share the same core AutoShutdown architecture and charge-pump capabilities.
Publicly confirmed substitute part numbers include MAX3223EAP+T (SSOP-20 package) and MAX3223ECAP+ (SSOP-20 package). These alternatives maintain the same electrical characteristics and pinout but differ in physical package dimensions. Verify thermal resistance values and land pattern compatibility when transitioning between TSSOP and SSOP packages.