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The MAX3272AETP+TG05 is a +3.3V, 2.5Gbps low-power limiting amplifier manufactured by Analog Devices Inc./Maxim Integrated. It accepts a wide range of input voltages and provides constant-level output voltage with controlled edge speeds. The device features current-mode logic (CML) data outputs tolerant of inductive connectors and includes power detectors with programmable loss-of-signal indication. It operates on a single +3.3V supply with a typical supply current of 33mA. Key electrical parameters include 5ps deterministic jitter, 90ps edge speed, and an operating temperature range from -40°C to +85°C.
Verify the specific suffix TG05 against official manufacturer documentation to confirm tape-and-reel packaging details and lot traceability requirements. Ensure compatibility with the specified -40°C to +85°C industrial temperature range during procurement planning. Cross-reference the lead-free designation (+) with RoHS compliance standards required for your assembly process. Confirm availability status directly with authorized distributors as supply conditions may vary.
Select this component for applications requiring low-power operation at data rates up to 2.5Gbps. The device is suitable for compact optical receivers where space is limited due to its small package footprint. Consider the built-in offset-correction loop and programmable LOS thresholds for systems needing robust signal integrity monitoring. Ensure the design accommodates the CML output interface requirements and appropriate termination resistors for optimal performance.
This part belongs to the MAX3272/MAX3272A family of +3.3V, 2.5Gbps low-power limiting amplifiers. The MAX3272A variant specifically includes ESD protection on the LOS pins, distinguishing it from the standard MAX3272 which lacks this feature. Both devices share identical electrical characteristics and functionality, differing primarily in the robustness of the loss-of-signal output stage against electrostatic discharge events.
The MAX3272EGP and MAX3272AEGP are confirmed substitutes within the same family, offering equivalent functionality in a standard QFN package instead of the Thin QFN. Verify pinout compatibility and thermal dissipation requirements when transitioning between package types. No functional changes are implied by the ordering suffix variations documented in the datasheet.