MAX3314EEKA#TG16

Overview

The MAX3314EEKA#TG16 is a single RS-232 transceiver in an 8-pin SOT-23 package. It operates with dual ±5V supplies and supports data rates up to 460kbps. The device provides ±3.7V output levels compliant with EIA/TIA-232 standards. It features a shutdown mode that reduces supply current to 1µA while keeping the receiver active. ESD protection ratings include ±15kV for the Human Body Model and ±8kV for IEC 1000-4-2 Contact Discharge.

Feature Summary

• Integrated ±15kV HBM and ±8kV IEC contact discharge ESD protection on I/O pins
• Low-power shutdown mode reducing supply current to 1µA with active receiver
• Guaranteed 460kbps data rate with ±3.7V RS-232-compatible output levels

Applications

• Digital Cameras
• GPS Receivers
• Point-of-Sale (POS) Terminals
• Telecommunications Equipment

Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm the specific suffix matches the required temperature range and packaging format. Request official datasheets and material declarations to ensure compliance with relevant environmental regulations before finalizing procurement decisions.

Selection Notes

Select this component when designing systems requiring robust RS-232 communication in compact spaces. Ensure the design accommodates external ±5V power rails, as internal charge pumps are not included. Verify that the operating environment falls within the specified -40°C to +85°C range for the EE variant.

Part Context

This part belongs to the MAX3314E family of single RS-232 transceivers manufactured by Analog Devices / Maxim Integrated. The family includes variants with different temperature ranges and package types, such as µMAX and SO packages. The EE suffix specifically denotes the extended industrial temperature range version housed in the SOT-23-8 footprint.

Replacement Considerations

Direct pin-to-pin replacements within the same series include MAX3314ECUA and MAX3314EESA. Verify that alternative packages maintain compatibility with the existing PCB layout and thermal requirements.