MAX3800UHJ+

Overview

The MAX3800UHJ+ is a +3.3V adaptive cable equalizer and cable driver integrated on a single chip, designed for coaxial and twin-axial point-to-point communications. It supports data rates up to 3.2Gbps and automatically adjusts to attenuation caused by skin-effect losses of up to 30dB at 1.6GHz. The device operates within an ambient temperature range of 0°C to +85°C and consumes approximately 200mW at +3.3V. It features differential CML inputs and outputs with adjustable output amplitude. The package is a 32-pin TQFP with an exposed pad.

Feature Summary

• Adaptive equalization automatically compensates for copper cable attenuation up to 30dB at 1.6GHz
• Integrated cable driver with adjustable output amplitude controlled by external resistor
• Includes loss-of-signal indicator and cable integrity monitor outputs
• On-chip input and output terminations minimize external component count

Applications

• High-speed links in communications and data systems
• Backplane and interconnect applications
• SDH/SONET transmission equipment

Procurement Notes

Verify the specific suffix 'UHJ+' corresponds to the 32-pin TQFP-EP package with lead-free construction and the 0°C to +85°C operating temperature range. Confirm that the exposed pad is properly soldered to the circuit board ground plane for thermal management and electrical performance as specified in the datasheet.

Selection Notes

Select this component when designing high-speed serial links requiring simultaneous signal driving and adaptive equalization on a single channel. Ensure the application utilizes differential or single-ended CML signaling compatible with the 3.2Gbps maximum data rate. Verify that the power supply voltage remains within the 3.14V to 3.46V range for proper operation.

Part Context

The MAX3800 is part of the Maxim Integrated line of high-speed interface solutions. It combines transmitter and receiver functions to simplify PCB layout for long copper runs. The UHJ variant specifically denotes the 32-lead Thin Quad Flatpack with an exposed pad, suitable for surface-mount assembly in compact electronic designs.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.