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MAX4298ESD+ is listed in the Audio Special Purpose range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC LINE DRIVER 14SOIC. Review the specifications below when checking this part for your BOM.
The MAX4298ESD+ is a stereo headphone driver IC designed for single +5V applications in noisy digital environments. It features ultra-high power-supply rejection (115dB DC, 93dB at 20kHz) and rail-to-rail output drive capability. The device operates within a supply voltage range of 4.5V to 5.5V and supports an operating temperature range of -40°C to +85°C. It delivers 1.5VRMS into a 10kΩ load with 0.0008% THD+N and drives 32Ω headphones to 1.2VRMS with 0.02% distortion. The unit is housed in a 14-pin SO package.
Verify the specific ordering suffix 'ESD' corresponds to the 14-pin SO package and -40°C to +85°C temperature range as listed in the official Maxim Integrated ordering information. Confirm that the component matches the MAX4298 variant, which includes only the stereo headphone driver without the microphone amplifier or linear regulator found in the MAX4299.
Select this component when board space is limited and the digital power supply is noisy. Ensure the application requires a stereo headphone driver with high PSRR. Verify that the load impedance and capacitive requirements are within the specified limits for stable operation. Check if additional features like a microphone amplifier or regulator are needed, which would require the MAX4299 instead.
The MAX4298 is part of the MAX4298/MAX4299 family of audio system ICs designed for harsh digital environments. While the MAX4299 integrates a stereo headphone driver, a microphone amplifier, and a 100mA linear regulator, the MAX4298 provides only the stereo headphone driver functionality. Both share the same core architecture for ultra-high PSRR and clickless/popless performance.
The MAX4298EUB+ is a pin-compatible alternative available in a 10-pin µMAX package. Designers must verify footprint compatibility and ensure that the reduced pin count does not impact external component connections or thermal dissipation requirements.
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