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MAX4619CEE+ is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC INTEGRATED CIRCUIT. Review the specifications below when checking this part for your BOM.
The MAX4619CEE+ is a high-speed, low-voltage CMOS analog multiplexer switch IC manufactured by Analog Devices Inc./Maxim Integrated. It features three independent SPDT (Single Pole Double Throw) channels housed in a 16-lead QSOP surface-mount package. The device operates on a single supply voltage ranging from 2V to 5.5V. Key electrical specifications include a maximum on-resistance of 10 ohms, a maximum turn-on time of 15 ns, and a maximum turn-off time of 10 ns. The component supports a continuous DC switch current of 75 mA and exhibits a maximum power dissipation of 696 mW.
Verify the specific suffix 'CEE+' to confirm the 16-lead QSOP package variant. Confirm RoHS compliance status as indicated in official documentation. Check for obsolescence notices, as this part may be subject to discontinuation. Ensure the ordering quantity matches the tube packaging format typically associated with this package style.
Select the MAX4619CEE+ when three independent SPDT switches are required in a small form factor. Compare against the MAX4618 series if four-channel configurations or different resistance characteristics are needed. Verify that the 10-ohm on-resistance meets the application's signal integrity requirements. Ensure the operating temperature range aligns with the commercial grade specification.
This component belongs to the MAX461x family of high-speed, low-voltage CMOS analog multiplexers. It shares functional similarities with the MAX4618 and MAX4619E variants but differs in channel count and package type. The MAX4619 specifically provides three SPDT channels, whereas the MAX4618 offers two 4:1 multiplexer channels. This family is designed for applications demanding fast switching speeds and low power consumption.
The MAX4619ESE+ serves as a pin-compatible alternative offering the same electrical performance in a SOIC-Narrow-16 package. Designers must verify package dimensions and thermal characteristics when substituting between QSOP and SOIC footprints.
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