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MAX463ENG is listed in the Video Amps And Modules range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC RGB SWITCH 24 DIP. Review the specifications below when checking this part for your BOM.
The MAX463ENG is a two-channel, triple buffered RGB video switch and buffer housed in a 24-pin narrow plastic DIP package. It integrates high-accuracy, unity-gain-stable amplifiers with high-performance video switches. The device operates on ±5V supplies, supporting inputs and outputs up to ±2.5V when driving 150Ω loads. Key electrical characteristics include a 100MHz unity-gain bandwidth, 20ns channel switching time, and 5pF input capacitance. It features low differential gain and phase error, ensuring signal integrity for color video applications.
Verify the specific suffix 'ENG' corresponds to the 24-pin narrow plastic DIP package and the -40°C to +85°C temperature range as listed in the ordering information. Confirm that the component matches the original Maxim Integrated specifications before integration into designs requiring precise video signal routing.
Select this component for designs requiring dual-channel RGB video switching with integrated buffering. It is suitable for systems needing direct drive of 50Ω or 75Ω back-terminated cables. Ensure the design accommodates the required ±5V supply rails and utilizes proper bypassing to maintain the specified AC performance and crosstalk isolation.
This part belongs to the MAX463–MAX470 series of two-channel, triple/quad buffered video switches and buffers. The series combines video switching capabilities with amplifier functions to handle RGB signals efficiently. The MAX463 variant specifically provides triple buffering with unity gain, distinguishing it from other family members that offer quad buffering or gain-of-two configurations.
Compatible substitutes within the same series include MAX463CNG (commercial grade) and MAX463EWG (wide temperature SOIC). Verify pin compatibility and thermal dissipation requirements when transitioning between DIP and SOIC packages.
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