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MAX4649EKA+TG0N is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is INTEGRATED CIRCUIT. Review the specifications below when checking this part for your BOM.
The MAX4649EKA+T is a dual-supply, single-pole/double-throw (SPDT) analog switch housed in an 8-pin SOT23 package. It operates from a single +9V to +36V supply or ±4.5V to ±20V dual supplies. The device features a maximum on-resistance of 45Ω and a maximum flatness of 7Ω over the specified signal range. Switch transition time is typically 90ns with a maximum of 130ns at +25°C. Off-leakage current is limited to 2nA max at +25°C. The switch supports rail-to-rail analog signals and includes TTL/CMOS-compatible control inputs.
Verify the component designation against official manufacturer documentation to confirm the specific suffix indicates tape-and-reel packaging. Ensure the ordering information matches the required temperature range and package type for your design. Cross-reference the datasheet revision date to validate electrical characteristics before finalizing procurement specifications.
Select this component when high-voltage single or dual supply operation is required within the specified ranges. Consider the 45Ω on-resistance and 130ns transition time for signal routing applications. Verify that the SOT23-8 package dimensions fit the board layout constraints. Ensure the control logic levels are compatible with the TTL/CMOS input requirements.
The MAX4649 belongs to the Maxim Integrated analog switch family designed for telecommunications and test equipment. It provides a compact solution for signal switching in space-constrained designs. The device utilizes CMOS technology to achieve low power consumption and high isolation. It serves as a replacement for mechanical relays in redundant systems and audio applications.
The MAX4659ESA+ is a documented alternative offering lower on-resistance in an 8-SOIC package. Evaluate pin compatibility and voltage range differences when substituting. Verify that the package footprint and thermal characteristics meet the existing design requirements.
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