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MAX4693EGE+T is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC SWITCH SPDT X 3 70OHM 16QFN. Review the specifications below when checking this part for your BOM.
The MAX4693EGE+T is a low-voltage CMOS analog integrated circuit configured as three single-pole double-throw (SPDT) switches. It operates from a single +2V to +11V supply or dual ±2V to ±5.5V supplies. Key electrical parameters include an on-resistance of 70Ω max at +2.7V, 35Ω max at +5V, and 25Ω max at ±4.5V. The device features a maximum transition time of 90ns, off-leakage current of 20nA max at +85°C, and crosstalk of -90dB at 100kHz. It is housed in a 16-pin QFN-EP package with an operating temperature range of -40°C to +85°C.
Verify the specific ordering suffix EGE+T corresponds to the 16-pin QFN-EP package configuration. Confirm that the lead-free and RoHS-compliant status matches project requirements. Ensure the component source is an authorized distributor to guarantee authenticity and traceability for production integration.
Select this component when three independent SPDT switching paths are required within a compact footprint. Verify that the supply voltage range aligns with the system's power architecture. Consider the on-resistance specifications relative to the signal levels and load conditions to ensure acceptable signal integrity and insertion loss performance.
This part belongs to the MAX4691–MAX4694 family of low-voltage CMOS analog switches. While the MAX4691 provides an 8:1 multiplexer and the MAX4692 offers dual 4:1 multiplexers, the MAX4693 specifically integrates three SPDT switches. All variants share similar electrical characteristics and package options, allowing for flexible design scaling within the same product line.
Direct functional substitutes within the same series include the MAX4691EGE+T and MAX4692EGE+T, provided the pinout compatibility and switch configuration meet the circuit requirements. Verify that any alternative component maintains the same 16-pin QFN-EP package dimensions and thermal dissipation characteristics.
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