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MAX4704ETC+T is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC SWITCH SP4T X 1 60OHM 12TQFN. Review the specifications below when checking this part for your BOM.
The MAX4704ETC+T is a single-pole quadruple-throw (SP4T) analog switch manufactured by Analog Devices Inc./Maxim Integrated. It operates within a supply voltage range of 1.8V to 5.5V and features a maximum on-resistance of 60 ohms with a channel-to-channel matching of 1 ohm. The device provides a -3dB bandwidth of 200MHz, charge injection of 2pC, and off-state leakage current of 100pA. Switching times are specified at 60ns for turn-on and 20ns for turn-off. It is housed in a 12-TQFN package and supports an operating temperature range from -40°C to +85°C.
Verify the specific suffix 'ETC+T' against official manufacturer documentation to confirm the tape-and-reel packaging format and lead-free status. Ensure the component meets RoHS compliance requirements for your assembly process. Cross-reference the part number with authorized distributors to confirm current availability and authenticity before procurement.
Select this component when a single SP4T switch is required within a 1.8V to 5.5V supply range. Consider the 60-ohm on-resistance and 200MHz bandwidth for signal path requirements. The 12-TQFN package is suitable for space-constrained surface-mount designs. Verify that the 100pA leakage and 2pC charge injection meet system precision needs.
The MAX4704 belongs to the Maxim Integrated family of low-voltage analog switches. This series is designed for applications requiring small form factors and low power consumption. The ETC+T designation indicates a specific thermal and packaging variant within the broader MAX4704 product line, optimized for surface-mount assembly processes.
Check for direct pin-compatible alternatives within the MAX470x series or other SP4T switches from Analog Devices. Verify electrical parameters such as on-resistance, bandwidth, and supply voltage compatibility. Confirm package dimensions and thermal characteristics match the existing design constraints.
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