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MAX4708ESE+T is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC MUX 8:1 400OHM 16SOIC. Review the specifications below when checking this part for your BOM.
The MAX4708ESE+T is a single 8-to-1 fault-protected multiplexer in a 16-pin Narrow SO package. It operates with dual supplies of ±4.5V to ±20V or a single supply of +9V to +36V. The device provides ±40V overvoltage protection when supplies are off and ±36V when supplies are on. Key electrical parameters include a maximum on-resistance of 400Ω, a maximum on-resistance match between channels of 15Ω, and a typical off-isolation of -70dB at 1MHz. Enable turn-on time is typically 275ns, while enable turn-off time is typically 200ns. The operating temperature range is -40°C to +85°C.
Verify the specific ordering suffix against official documentation to confirm the tape-and-reel packaging format associated with the 'T' designation. Confirm the narrow SOIC footprint dimensions and pin spacing requirements prior to PCB layout finalization. Ensure the design accounts for the specified thermal derating characteristics within the operational temperature range.
Select this component for applications requiring high-voltage fault tolerance on analog signals. Verify that the required channel count matches the single 8-to-1 configuration. Ensure the system voltage rails fall within the specified single or dual supply ranges. Check that the logic interface levels align with the TTL/CMOS compatible thresholds defined in the datasheet.
This part belongs to the MAX4708/MAX4709 family of fault-protected multiplexers. It serves as a pin-compatible replacement for industry-standard DG508/DG509 devices. Unlike the MAX4508/MAX4509 series, these devices lack clamp diodes to the supply rails on the switch outputs, enabling true rail-to-rail operation.
The MAX4708EPE+ and MAX4708EWE+ offer identical functionality in Plastic DIP and Wide SO packages respectively. These variants maintain pin compatibility but differ in physical package dimensions and thermal dissipation capabilities.
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