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MAX4721EBL is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC SWITCH SPST-NO X 2 3OHM 8UCSP. Review the specifications below when checking this part for your BOM.
The MAX4721EBL is a dual single-pole single-throw (SPST) normally-closed analog switch manufactured by Analog Devices Inc./Maxim Integrated. It operates on a single supply voltage ranging from 1.8V to 5.5V. The device features a maximum on-resistance of 4.5 ohms and a channel-to-channel matching of 100 milliohms. Key electrical parameters include a -3dB bandwidth of 300MHz, charge injection of 5pC, and off-state leakage current of 500pA maximum. Switching times are specified at 80ns for turn-on and 40ns for turn-off. It is housed in a compact 9-WLP package and supports an operating temperature range of -40°C to 85°C.
Verify component authenticity through authorized Analog Devices distributors. Confirm the specific suffix matches the required tape-and-reel packaging format. Check for RoHS compliance status as per current manufacturing standards. Ensure the supplier provides valid traceability documentation for quality assurance purposes.
Select this component when low on-resistance and high bandwidth are critical for signal fidelity. The dual SPST architecture suits applications requiring independent control of two signal paths. Verify that the 1.8V to 5.5V supply range aligns with the system power rails. Consider the 9-WLP package constraints during PCB layout planning.
The MAX4721EBL belongs to the MAX4721-MAX4723 family of precision analog switches. These devices are designed for portable electronics where power efficiency and small form factors are essential. The family shares similar electrical characteristics but varies in pin count and package options to accommodate different circuit complexity requirements.
Direct substitutes within the same family include the MAX4721EUA and MAX4721EBL-T. Cross-reference pinouts and electrical specifications before implementation. Ensure thermal performance and package dimensions are compatible with existing board designs.
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