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MAX4722EBL+T is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC SWITCH SPST-NCX2 4.5OHM 9WLP. Review the specifications below when checking this part for your BOM.
The MAX4722EBL+T is a dual single-pole/single-throw (SPST) analog switch featuring normally closed contacts. It operates from a single +1.8V to +5.5V supply and provides a maximum on-resistance of 4.5Ω at +3V. The device offers rail-to-rail signal handling, low charge injection of 5pC, and an off-leakage current of 500pA. It includes break-before-make switching with a turn-on time of 80ns and turn-off time of 40ns. Packaged in a 9-WLP format, it supports -40°C to +85°C operation.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and check for specific ordering suffixes that may indicate tape-and-reel packaging variations. Ensure assembly methods align with UCSP package reliability requirements regarding solder profiles and mechanical stress.
Select this part when a normally closed default state is required for dual-channel switching. Compare against MAX4721 for normally open configurations or MAX4723 for mixed NO/NC needs. Evaluate the UCSP package suitability against standard leaded packages if mechanical robustness during board assembly is a primary concern.
This component belongs to the MAX4721/MAX4722/MAX4723 family of low-voltage analog switches. While sharing identical electrical specifications and pinouts, the MAX4722 is distinguished by its dual normally closed architecture. It utilizes Maxim's UCSP wafer-level chip-scale packaging technology for minimal footprint.
MAX4721EUA: Identical electrical specs but features normally open switches instead of normally closed.
The MAX4722 contains two normally closed (NC) switches, whereas the MAX4721 contains two normally open (NO) switches. All other electrical characteristics remain identical.
The UCSP package requires specific solder temperature profiles, such as infrared or vapor phase reflow, and prohibits hand or wave soldering to prevent damage to the bump structure.
Yes, the device supports rail-to-rail signal handling, allowing analog signals ranging from GND to V+ to pass through with minimal change in on-resistance.
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