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MAX4968CEXB+ is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC SW SPST-NOX16 34OHM 64CTBGA. Review the specifications below when checking this part for your BOM.
The MAX4968CEXB+ is a high-voltage analog switch IC featuring sixteen independent SPST channels in a CTBGA-64 package. It operates on a single supply voltage ranging from 2.37 V to 5.5 V, or dual supplies between -200 V/10 V and 0 V/12.5 V. The device exhibits a maximum on-resistance of 34 Ohms with a 30 MHz bandwidth. Switching times are limited to 5 µs for turn-on and 3.5 µs for turn-off. It functions within an industrial temperature range of -40°C to +85°C and consumes a maximum supply current of 50 µA.
Verify the specific suffix against official Analog Devices documentation to confirm package type and tape-and-reel configuration. Ensure the ordering part number matches the required thermal and mechanical specifications for the target PCB layout. Cross-reference the manufacturer's latest datasheet revision to validate compliance with current environmental standards before finalizing procurement orders.
Select this component when designing circuits requiring high-voltage handling capabilities alongside multi-channel switching density. Evaluate the 34 Ohm on-resistance against the load requirements to ensure acceptable signal attenuation. Confirm that the 5 µs switching speed aligns with the system's timing constraints and that the CTBGA-64 footprint fits the available board space.
This device belongs to the MAX4968 family of high-voltage CMOS analog switches designed by Maxim Integrated, now part of Analog Devices. The series addresses the need for robust signal routing in environments where standard low-voltage switches cannot withstand the required potential differences. The CEXB variant specifically denotes the surface-mount BGA packaging option.
The MAX4968ECM+T offers equivalent electrical performance in a 48-LQFP package. Verify pin compatibility and thermal dissipation requirements when transitioning between the CTBGA and LQFP form factors.
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