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The MAX5092AATE+T is a dual-output power management integrated circuit combining a step-down (buck) converter and a low-dropout (LDO) regulator. It accepts an input voltage range of 4V to 72V, utilizing an internal boost pre-regulator to ensure stable operation across the wide input spectrum. The device features a switching frequency of 1MHz for the buck section and provides two independent outputs: one adjustable or fixed buck output and one LDO output capable of delivering up to 250mA. Designed for high-voltage industrial applications, it operates within a temperature range of -40°C to +125°C and is housed in a 16-TQFN (5x5mm) package with an exposed pad for thermal dissipation.
Verify the exact suffix and tape/reel packaging specifications against the manufacturer's latest datasheet before ordering. Confirm that the 16-TQFN footprint matches your PCB design constraints. Ensure compatibility with the required input voltage range and output current demands. Check for any recent product change notices or obsolescence announcements from Analog Devices. Validate RoHS compliance status if required by your manufacturing standards.
Select this component when a single IC solution is needed to handle both high-voltage step-down conversion and clean linear regulation. It is suitable for designs where board space is limited and a wide input voltage range is mandatory. Consider the thermal performance of the TQFN package under maximum load conditions. Evaluate the need for the internal boost pre-regulator if operating near the lower end of the input voltage range.
This part belongs to the MAX5092 family of dual-output regulators designed for robust industrial environments. It addresses the challenge of powering mixed-signal circuits from high-voltage sources without requiring multiple discrete components. The integration of buck and LDO technologies allows for efficient power conversion alongside noise-sensitive analog supply requirements.
Check for direct pin-to-pin replacements within the MAX5092 series with different output configurations. Verify availability of alternative packages if the TQFN form factor is unsuitable. Consult manufacturer cross-reference guides for updated components replacing older revisions.