MAX5489ETE#TG16

Overview

The MAX5489ETE#TG16 is a dual, linear-taper digital potentiometer featuring a 3-wire SPI-compatible interface and nonvolatile EEPROM memory. It provides two independent resistor arrays with an end-to-end resistance of 100kΩ and 256 tap positions. The device operates on a single +2.7V to +5.25V supply, maintaining a low 35ppm/°C temperature coefficient. It includes ±1 LSB INL and ±0.5 LSB DNL in voltage-divider mode. The unit is housed in a 16-pin TQFN package and supports extended operating temperatures from -40°C to +85°C.

Feature Summary

• Dual 100kΩ resistive arrays with 256 programmable tap positions
• Nonvolatile EEPROM retains wiper settings across power cycles
• SPI-compatible serial interface for direct control
• Low drift characteristics with 35ppm/°C end-to-end tempco

Applications

• LCD screen adjustment and bias control
• Audio volume control circuits
• Mechanical potentiometer replacement
• Low-drift programmable filters
• Programmable-gain amplifiers

Procurement Notes

Verify the specific ordering suffix against manufacturer documentation to confirm lead-free status and packaging configuration. Confirm that the component meets RoHS compliance requirements for the intended assembly process. Ensure the selected package variant matches the PCB footprint design specifications.

Selection Notes

Select this model when a 100kΩ resistance value is required for the application circuit. Compare performance against MAX5487 (10kΩ) and MAX5488 (50kΩ) if different resistance ranges are needed. Verify that the 16-pin TQFN package dimensions fit within the available board space constraints.

Part Context

This component belongs to the MAX5487/MAX5488/MAX5489 family of dual digital potentiometers. All variants share identical pinouts, interfaces, and nonvolatile memory features, differing only in their end-to-end resistance values. The ETE designation indicates the 16-pin TQFN package format.

Replacement Considerations

MAX5489EUD+ serves as a functional equivalent in a 14-pin TSSOP package. Substitution requires verification of physical footprint compatibility and thermal dissipation capabilities due to the difference in package type.