MAX6616AEG+T

Description：IC TEMP MON FAN CNTRL 24QSOP
Series：-
Mfr：Analog Devices Inc./Maxim Integrated
Package：Tape & Reel (TR)

SKU:2d4847a1d280 Category: Thermal Management Brand: Analog Devices Inc./Maxim Integrated

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Product introduction

MAX6616AEG+T is listed in the Thermal Management range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC TEMP MON FAN CNTRL 24QSOP. Review the specifications below when checking this part for your BOM.

Thermal Management specifications for MAX6616AEG+T

Description：IC TEMP MON FAN CNTRL 24QSOP
Series：-
Mfr：Analog Devices Inc./Maxim Integrated
Package：Tape & Reel (TR)
Function：Fan Control, Temp Monitor
Sensor Type：Internal and External
Sensing Temperature：0°C ~ 140°C
Accuracy：±4°C Local(Max), ±1°C Remote(Max)
Topology：ADC
Output Type：I2C/SMBus
Output Alarm：Yes
Output Fan：Yes
Voltage - Supply：3V ~ 5.5V
Operating Temperature：-40°C ~ 125°C
Grade：-
Qualification：-
Mounting Type：Surface Mount
Package / Case：24-SSOP (0.154", 3.90mm Width)
Supplier Device Package：24-QSOP

Thermal Management datasheet and documents for MAX6616AEG+T

MAX6616AEG+T

Thermal Management Overview

The MAX6616AEG+T is a dual-channel board-mount temperature sensor IC manufactured by Analog Devices Inc. under the Maxim Integrated brand. It operates within a supply voltage range of 3 V to 5.5 V and features an accuracy of +/- 1 C. The device supports I2C and SMBus interfaces and includes local and remote temperature monitoring configurations. It is housed in a QSOP-24 package with a maximum power dissipation of 761.9 mW and consumes 500 uA of operating current.

Thermal Management Feature Summary

Dual-channel thermal monitoring capability supporting both local and remote sensing configurations
Digital interface compatibility with standard two-wire, I2C, and SMBus protocols
Integrated hardware monitoring functions for system thermal management

Thermal Management Applications

Server and storage system thermal monitoring
Industrial equipment temperature supervision
Consumer electronics thermal protection

Thermal Management Procurement Notes

Verify component authenticity through authorized distribution channels due to limited availability status. Confirm RoHS compliance details prior to integration. Check for obsolescence indicators as the lifecycle status may affect long-term supply continuity. Ensure packaging specifications match design requirements for surface mount assembly processes.

Thermal Management Selection Notes

Select this component when dual-zone temperature monitoring is required with digital interface connectivity. Consider the QSOP-24 package constraints and 3 V to 5.5 V operating range during circuit design. Evaluate the 500 uA current consumption against system power budgets. Verify that the +/- 1 C accuracy meets application precision requirements.

Thermal Management Part Context

This part belongs to the MAX6616 series of thermal monitors and fan controllers. It is designed for applications requiring precise temperature measurement with digital communication capabilities. The device integrates local and remote sensing inputs to provide comprehensive thermal oversight in compact form factors suitable for space-constrained electronic designs.