MAX6641AUB90+T

Thermal Management Overview

The MAX6641AUB90+T is a board-mount temperature sensor and hardware monitor manufactured by Analog Devices Inc./Maxim Integrated. It features an SMBus-compatible interface for digital communication. The device operates within a supply voltage range of 3V to 5.5V and supports an operating temperature range from -40°C to +125°C. It provides local temperature sensing with an accuracy of +/- 4°C and utilizes an 8-bit resolution. The component is housed in a USOP-10 package, designed for surface mount technology applications requiring thermal monitoring.

Thermal Management Feature Summary

• Integrates automatic PWM fan-speed control capabilities
• Supports standard System Management Bus (SMBus) protocol
• Includes dedicated thermal diode input for external sensing

Thermal Management Applications

• Server hardware monitoring systems
• Desktop computer thermal management
• Industrial equipment temperature regulation

Thermal Management Procurement Notes

Verify the specific suffix '90' against current manufacturer documentation to confirm pinout and feature set compatibility. Check availability status as some variants may be discontinued or subject to limited supply constraints. Ensure the USOP-10 package dimensions align with the target PCB footprint design requirements before finalizing procurement orders.

Thermal Management Selection Notes

Select this component when SMBus integration is required alongside active cooling control. Consider the +/- 4°C accuracy specification against system thermal tolerance limits. Evaluate the 3V to 5.5V supply range compatibility with existing system power rails. Confirm that the USOP-10 surface mount package fits within the available board space constraints.

Thermal Management Part Context

This part belongs to the MAX6641 series of thermal monitors and fan controllers. It is designed for applications requiring precise temperature measurement and automated fan speed adjustment via digital interfaces. The series typically integrates local and remote sensing capabilities within a compact form factor suitable for modern electronic assemblies.

Thermal Management Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.