MAX7301ANI+

Overview

The MAX7301ANI+ is a serial-interfaced I/O expander providing 20 ports in a 28-pin DIP package. It operates on a supply voltage of 2.5V to 5.5V with an operating temperature range of -40°C to +125°C. Each port is individually configurable as a push-pull logic output or Schmitt trigger input with optional internal pullup. The device supports a high-speed 26MHz SPI-compatible 4-wire interface and features transition detection for seven ports (P24–P30) via an interrupt output on P31. Shutdown current is 11µA maximum.

Feature Summary

• Configurable push-pull outputs and Schmitt trigger inputs with selectable internal pullups
• Maskable logic transition detection for seven specific I/O ports generating an interrupt signal
• SPI-compatible 4-wire serial interface supporting daisy-chain configurations

Applications

• White Goods
• Automotive
• Gaming Machines
• Industrial Controllers
• System Monitoring

Procurement Notes

Verify the component matches the exact MAX7301ANI+ designation, specifically confirming the 28-pin DIP package and Analog Devices/Maxim Integrated manufacturer origin. Ensure the suffix indicates standard commercial specifications without unique functional deviations. Cross-reference datasheet revision 4 documentation for accurate pinout and electrical limits before integration.

Selection Notes

Select this part when a 20-port GPIO solution is required in a through-hole DIP format. It is suitable for systems needing low shutdown current and transition detection capabilities. Consider alternative packages like SSOP or QFN if board space constraints require surface-mount technology or if a higher port count of 28 is necessary.

Part Context

This component belongs to the MAX7301 family of 4-wire-interfaced I/O expanders. While other variants such as the MAX7301AAI offer identical functionality in a 28-pin SSOP package, the ANI variant specifically utilizes a 28-pin DIP configuration. This distinguishes it from the 28-port AAX and AGL models which utilize different pin counts and package types.

Replacement Considerations

The MAX7301AAI serves as a direct functional substitute within the same package footprint category but utilizes a 28-pin SSOP form factor instead of DIP. Designers must verify mechanical clearance and soldering process compatibility when substituting between DIP and SSOP packages.