MAX7318AUG+T

Overview

The MAX7318AUG+T is a 2-wire-interfaced, 16-bit I/O port expander designed for SMBus and I2C applications. It provides 16 configurable input/output ports with an open-drain interrupt output. The device operates within a supply voltage range of 2V to 5.5V and supports a maximum clock frequency of 400kHz. It features hot-insertion protection, allowing pins to remain high-impedance up to 6V when powered down. The component is housed in a 24-pin TSSOP package and is specified for operation over the -40°C to +125°C temperature range.

Feature Summary

• Supports hot insertion with high-impedance state on all pins during power-down
• Configurable polarity inversion for input data
• Open-drain interrupt output activates on input state changes
• Sixty-four selectable slave ID addresses via three address pins

Applications

• Servers
• RAID Systems
• Industrial Control
• Medical Equipment
• PLCs

Procurement Notes

Verify the specific ordering suffix AUG+T corresponds to the 24-pin TSSOP package variant. Confirm RoHS compliance status through official manufacturer documentation or authorized distributors. Ensure the source document explicitly lists this part number as available or discontinued before procurement planning.

Selection Notes

Select this component when 16 general-purpose I/O lines are required alongside interrupt capabilities. Verify that the system bus supports I2C/SMBus protocols at speeds up to 400kHz. Ensure the operating environment falls within the -40°C to +125°C automotive temperature range and supply voltage constraints between 2V and 5.5V.

Part Context

This device belongs to the MAX7318 family of 2-wire-interfaced I/O expanders. It shares functional similarities with the MAX7311 and MAX7312 but distinguishes itself by including hot-insertion protection and an interrupt output feature not present in all family members.

Replacement Considerations

Publicly confirmed substitute part numbers include MAX7318AWG+, MAX7318AAG+, and MAX7318ATG+. These variants offer identical electrical functionality but differ in package type (SO, SSOP, or Thin QFN). Verify pin compatibility and thermal requirements before substitution.