MAX8582ETB+T

Overview

The MAX8582ETB+T is an RF downconverter IC designed for WCDMA applications, operating at a frequency of 1.5 GHz. It is housed in a compact 10-TDFN (3x3 mm) surface-mount package with an exposed pad. This component functions as a specialized converter within wireless communication systems.

Feature Summary

• Integrated RF downconversion capability optimized for WCDMA standards
• Compact 10-pin TDFN package design for space-constrained mobile devices

Applications

• WCDMA mobile phone front-end modules
• Wireless communication baseband processing interfaces
• RF signal conversion stages in portable handsets

Procurement Notes

Verify the exact suffix and RoHS compliance status against the official Analog Devices datasheet before integration. Confirm that the 10-TDFN footprint matches your PCB layout constraints. Ensure supply chain authenticity through authorized channels due to potential availability variations.

Selection Notes

Select this component when a dedicated low-profile downconverter for WCDMA signals is required. The 3x3 mm package size is critical for modern smartphone form factors. Verify interface compatibility with the target baseband processor and ensure thermal management suits the exposed pad design.

Part Context

This part belongs to the Maxim Integrated RF portfolio, specifically targeting cellular infrastructure and mobile terminals. It serves as a key element in the radio frequency front end, bridging the antenna interface with digital processing units in third-generation wireless networks.

Replacement Considerations

Check for direct pin-compatible alternatives within the MAX8582 series or newer generations from Analog Devices. Verify if updated versions offer improved linearity or lower noise figures while maintaining the same 10-TDFN footprint.